SOLDEX CREAM Syringe Liquid Flux Solder
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- SOLDEX CREAM
- Syringe Liquid Flux Solder Tin Paste 183 Melting Point Welding Flux Soldering Cream Repair PCB BGA CPU LED Rework Tool
- Components: Sn63, Pb37
- Weight: 10 g.
- Length: 102mm
- Weld metal weight: 89.8 ± 0.3%
- Residual: 5% on average
- Packaging: Injector / Syringe
- Package includes: 1*Sn63Pb37 (with moderate lead temperature) 35g + 1*push head + 2*needles
- Use:
- Before opening, the temperature of the solder paste should be raised to the ambient temperature (25℃), and the temperature return time should be about 3-4 hours.
- Solder paste should be kept at 1-10℃.
- Precautions:
- Keep it away from children.
- Avoid eye contact
- Solder paste contains an organic solvent. Avoid repeated skin contact. If solder paste gets on your skin, wipe it with alcohol and rinse thoroughly with water.
- Use only with adequate ventilation.
- Maintenance method:
- Solder paste should not be placed in the sun.
- Solder paste must be used within 6 months
- SMART DESIGN
- New technical support, the unique chemical formula provides excellent wetting, to ensure high reliability. Adapted to mobile phone repair industry, computer digital service industries and high precision SMT/BGA circuit board soldering processes.
- PCB/BGA DEDICATED
- High quality quality, unique formula, perfect performance, easy welding, the welding joint is bright and complete, no welding, false welding phenomenon.
- WIDE APPLICATION
- The residue is colorless and transparent, does not affect detection, disposable and excellent cleaning performance. The use of energy efficient thixotropic agents, printing collapse and preheating, special bonding ensure good printing and fine design.
- REVOLUTIONARY RESISTANCE
- Moisturizing, anti-dry, relatively long shelf life at room temperature. Unique high quality solder paste, thin and flexible packaging (10cc/support), slim appearance.
- What is Tin Solder Paste?
- Solder tin paste is a new type of solder material that comes with SMT.
- Solder paste is a complex system consisting of a paste of solder powder, flux and other additives.
- At normal temperature, tin solder paste has a certain viscosity, and the electronic component can be initially attached to a predetermined position.
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